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This chapter outlines on the various types of silicon wafers employed in the sensor fabrication, which are quite different them that of IC industry. Stringent specifications of silicon substrate are varied from application to application which is also covered in this chapter. MEMS technology very often uses double-site-polished (DSP) wafers, silicon-on-insulator (SOI) glass wafer, epi-wafers, high-resistive (ρ > 8 kΩ-un) silicon wafers for realizing different sensors, which are not traditionally used in standard microfabrication process.

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Wafer Criteria

  • 章节

  • 发表日期：

    2025年

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  • Kamaljeet Singh,
  • Ayan Karmakar

摘要

This chapter outlines on the various types of silicon wafers employed in the sensor fabrication, which are quite different them that of IC industry. Stringent specifications of silicon substrate are varied from application to application which is also covered in this chapter. MEMS technology very often uses double-site-polished (DSP) wafers, silicon-on-insulator (SOI) glass wafer, epi-wafers, high-resistive (ρ > 8 kΩ-un) silicon wafers for realizing different sensors, which are not traditionally used in standard microfabrication process.