Investigation of Temperature Rise in Magnetic Coupling Mechanisms via Electromagnetic-Thermal Bidirectional Coupling
摘要
The rise in temperature in the magnetic coupling mechanism is a critical factor affecting the operational state of wireless charging systems. To obtain a more accurate temperature field distribution in the region of the magnetic coupling mechanism, a numerical study of the electromagnetic-thermal bidirectional coupling process of the magnetic coupling mechanism was conducted using the finite element method. A computational model of the magnetic coupling mechanism was established based on the characteristics of the electromagnetic field and temperature field distributions. This model and finite element calculations determined the losses in the magnetic coupling mechanism. The non-uniform losses from the electromagnetic field analysis were loaded into the temperature field calculation mesh as heat source boundary conditions. Considering the impact of temperature changes on material properties, the temperature field analysis of the magnetic coupling mechanism was realised. The heat source was corrected based on the temperature at each iteration, achieving dynamic bidirectional coupling between the electromagnetic and temperature fields. This method enables rapid calculation of the electromagnetic and temperature characteristics of the magnetic coupling mechanism while ensuring acceptable accuracy, guiding the preliminary design of wireless charging.