The tiled laminate (TL), an innovative, bio-inspired oblique layered material developed by FiberCore® Europe as the skin material for their InfraCore® Inside panel, has attracted significant attention from composites researchers. This novel composite material can be identified by its unique structure, where individual plies are positioned at a slight angle to the outer surfaces, in contrast to the conventional plane-parallel (PP) configuration. The tiled laminate shows great potential for applications in bridge deck plates, complex roof shells, facade skins, and wind turbine blades, owing to its advantages in automated production and enhanced mechanical properties. However, the distinctive inclined lay-up configuration of this material renders classical laminate theory (CLT) inapplicable, necessitating more effective analytical and predictive methods, particularly for the non-linear phase following damage initiation. To address this challenge and facilitate a detailed characterization of its linear and non-linear mechanical properties—essential for efficient design and widespread application of this novel laminate—numerical simulations are employed to analyze the behavior of Tiled Laminates (TL) under tension. This study utilizes an enhanced 3D VUMAT subroutine within the Explicit/Dynamic module of the finite element software ABAQUS to simulate tensile tests on the tiled laminates. A detailed parametric analysis is conducted, focusing on the inclination angle of the fiber mats with respect to the horizontal plane, as this is a key characteristic of the panel structure. The numerical simulation results are used to compare the mechanical behavior of traditional plane-parallel (PP) laminates with that of tiled laminates. Furthermore, the study examines the influence of the inclination angle on the stiffness, ultimate strength, ultimate strain and failure behavior of tiled laminates. This comprehensive analysis provides valuable insights into the unique properties and failure mechanics of tiled laminates in structural applications.