This study examines the thermal cycling stability and latent heat capacity storage of organic SSPCM to improve the thermal management of electronic devices. Excessive heating in electronic devices can shorten their lifespan and potentially cause severe accidents. In comparison with sensible heat storage materials, PCMs offer a significantly higher thermal energy storage density, making them ideal for use as passive thermal storage solutions in electronic devices to facilitate effective cooling. This study includes an experimental analysis of SSPCM’s impact on electronic cooling applications. The characterization study was conducted before and after thermal cycling (100, 250, and 500 cycles) to evaluate the stability of SSPCM. The findings reveal that the thermal and chemical stability of PCMs remain mostly unchanged after thermal cycling. To further assess the heat storage performance, a heat sink device was fabricated. When neopentyl glycol (NPG), a type of PCM, was applied, the device temperature was reduced by 5.8 °C compared to the device without PCM. This reduction in temperature can mitigate the risk of overheating, thus preventing accidents and extending the lifespan of electronic devices. The results align with existing research indicating that PCMs are effective in managing the thermal loads of electronic components, maintaining their properties after multiple thermal cycles, and enhancing device safety and longevity. These findings validate the potential of SSPCMs as reliable materials for passive thermal management in electronic applications.