Conductive ink deposition represents a key advancement in printed electronics, enabling the creation of electronic circuits on various substrates. The syringe deposition method, characterized by its precision and versatility, allows for the accurate printing of electronic patterns using conductive ink. The previously developed model serves as a foundational framework for predicting ink deposition parameters. Additionally, substrate surface energy and ink surface tension play crucial roles in determining ink adhesion and spreading behaviour on different substrates. Understanding and optimizing these variables are essential for achieving high-quality printed features. By integrating these factors into mathematical models, one can enhance the accuracy and reliability of conductive ink deposition processes. This underscores the importance of continued research and development in this field to address challenges and drive innovation in printed electronics.