Crystalline silicon (c-Si) solar cells lead the solar cell market, accounting for around 90% of the total market. As c-Si solar cell technology progresses towards cost reduction, reducing the Si wafer substrate thickness has been of interest. Accordingly, an alternative processing technique should be proposed, as the c-Si solar cell fabrication process involves several critical steps that may be affected by the thinning of the Si wafer substrate. Among the vital processes in solar cell manufacturing, contact metallization is the most affected. The thinner wafer substrate will cause bowing if the high-temperature commercial annealing process is used. One of the alternatives to overcoming that problem is by raising the laser-based metallization process. In the past 20 years, laser-based metallization, also known as laser-fired contact (LFC), has garnered significant attention for its potential application in various solar cells. Still, it seems to fade away as research tends to develop new concepts for solar cell devices. This LFC leads to several advantages, most notably reducing mechanical stress, reducing cost as the temperature process is reduced, and simplifying the well-established photolithography processing step. Hence, in this paper, the need for an alternative metallization is highlighted, with the fundamental LFC analyzed.