Solder joints are important in electronic assemblies as the quality affects the reliability of the electronic devices. Conventional reflow heating (CR) is widely used but presents challenges as suboptimal wettability characteristics. This encourages alternative heating methods like microwave hybrid heating (MHH). This study investigates the influence of MHH on wetting angle, spreading ratio, and microstructural properties of solder joint SAC305 on Cu substrate compared to the CR method. The findings reveal that MHH significantly enhances the wetting properties of SAC305 solder by reducing the wetting angle from 26.38° (CR) to 15.94° and enhancing the spreading ratio from 86.77 to 93.38%, suggesting improved solder wettability. Surface roughness analysis shows a smoother joint surface with an average roughness (Ra) of 0.953 μm for MHH, indicating more uniform and consistent soldering. These findings suggest that MHH provides valuable insights into the optimization of soldering processes in the electronics manufacturing industry, highlighting the advantages of MHH in achieving a more efficient and reliable soldering process.