Electronic devices have been transformed significantly due to technological advancements. Ball grid array (BGA) component must be properly encapsulated by epoxy mold compound (EMC) as a packaging material. However, crack occurrence on the EMC of the BGA component during reflow soldering process has attracted much attention. The moisture content has potential to induce crack occurrence at the EMC encapsulation. Therefore, this study used different BGA component with variation of moisture content from 0.04% to 0.20% as test vehicle to investigate the crack occurrence of the EMC encapsulation during assembly process. All BGA components with and without moisture content were assembled on the printed circuit board (PCB) via reflow soldering process. It is shown that the moisture trapped in the BGA component of amount 0.20% likely play a significant role in inducing the 60% of crack formation on the EMC encapsulation. Therefore, moisture content in the BGA components must be addressed prior to reflow soldering process in addition to establish good BGA metallurgical joining between the component and PCB.