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An improved ViBe algorithm is presented to enhance the target extraction of complete wafers. Substrate images with clear edges, complete structure and low noise can be obtained by applying the improved ViBe algorithm. Experimental results show that the enhanced algorithm has higher accuracy and recall rate than other algorithms and the effect of IC wafer target extraction process on dynamic substrate is improved.

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Research on an Improved ViBe Algorithm to Enhance the Target Extraction of Moving IC Wafer

  • 会议论文

  • 发表日期：

    2025年

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  • Yifan Li,
  • Dongdong Kong,
  • Guiqin Li,
  • Lixin Lu,
  • Peter Mitrouchev

摘要

An improved ViBe algorithm is presented to enhance the target extraction of complete wafers. Substrate images with clear edges, complete structure and low noise can be obtained by applying the improved ViBe algorithm. Experimental results show that the enhanced algorithm has higher accuracy and recall rate than other algorithms and the effect of IC wafer target extraction process on dynamic substrate is improved.