For the optimization problem of the chip mounting process, this paper proposes a chip mounting optimization method based on an improved particle swarm algorithm from the point of view of improving the matching degree between the chip and the lead frame. Firstly, the objective optimization function of chip mounting is demonstrated for the requirements of chip mounting. Considering the sensitivity of the particle swarm algorithm to parameter values and its tendency to get stuck in local optima, a superior parameter update method is designed to enhance the efficiency of the algorithm. Experimental results show that the proposed method, based on the improved particle swarm algorithm, can effectively improve the quality and efficiency of chip mounting and significantly save the use of precious metals and other raw materials in the process of lead bonding, which has practical engineering applications and economic benefits.