Information technologies such as the Internet of Things (IoT) and smart phone are still the driving force of the high-volume manufacturing of the semiconductor devices. And recently, the data center requires advanced semiconductor devices. The lithographic technology achieves the high electronic performances and decreases the production costs per transistor of advanced semiconductor devices. In the lithography, photoresist materials and process are the most significant technology to achieve advanced fine pattern. According to the Roadmap of imec, a metal pitch pattern width of 12 or 10 nm will be produced in 2039. This chapter describes not only the history of the resist materials but also the advanced materials for EUV lithography, including the shortening wavelength of it.