Glue path measurement is a critical part of the integrated circuit manufacturing process. Conventional glue measurement methods have limitations when facing highly integrated and complex chips. To this end, we propose a step model based glue path measurement algorithm to measure the height and width of the glue path precisely. The algorithm takes advantage of the coordinate distribution of the point cloud of the glue path and combines the glue path step model to obtain the width of the glue path. Specifically, firstly, the point cloud of the glue path is divided into the convex area, the upper surface area and the basal area. Secondly, the RANSAC is utilized to fit the point cloud of the basal area into a plane, and the average distance from the upper surface area to the basal plate is utilized as the height of the glue path. Finally, experimental results on four point clouds of the glue path show that the average relative errors of the height and width measurement of the glue path are 6.271% and 6.528%, respectively, thus verifying the effectiveness of the proposed algorithm.