This article investigates the main factors affecting the packaging stress of MEMS gyroscopes, especially the die attach stress. The research object is the gyroscope encapsulated by the ceramic shell. Simulations were conducted on the effects of substrate materials, types of adhesives, and adhesive processes on the stress and equivalent performance output of gyroscope sensitive structures. The simulation results show that the thermal expansion coefficient of the substrate material, the elastic modulus of the adhesive material, and the shape of the adhesive have significant impact on the stress of the gyroscope mounting. By selecting the optimal low stress packaging scheme, a high-precision MEMS gyroscope with full-temperature accuracy better than 10°/h was obtained, and the reliability of the packaging was also verified through high and low temperature experiments.