Electroforming produces complex structures using a negative mandrel, enabling lightweight and deformity-resistant components, valuable in various industries such as: aerospace, automation, biomedical, electronics, etc. Electroforming on 3D printed templates has the potential to become an adaptable and cost-effective manufacturing process for producing complex three-dimensional metallic parts. In this work a comparative study of electroforming technologies to fabricate copper pillars on 3D printed ABS (acrylonitrile butadiene styrene) templates is presented. COMSOL Multiphysics 5.5 is maneuvered to scrutinize the modelling of electrodeposition process under this study. This simulation study helps with finite element analysis of the electrodeposition process to model, simulate and understand the electroforming process under various parameters and conditions such as: varying anode orientations, inter-electrode gap variation, time of deposition, average current density and changing electrode potential individually. From the results we have found that increasing the deposition period resulted in thicker deposits, whereas increasing the inter-electrode spacing resulted in thinner deposits. For the given template the top position of the anode is considered as the best orientation for the uniform deposition at every pillars. An interelectrode gap of 20 mm is considered as the optimum interelectrode gap with 65 μm thickness of deposition with fix value of current density and deposition time. Further, the time of deposition plays significant role in deposited thickness, it can be observed that the thickness of deposition is continuously increasing from 30 to 120 μm when deposition time varies from 300 to 2700 s. In the similar fashion, when the current density is increasing from 3 to 6 A/dm2, thickness of deposition is increasing from 40 to 140 μm keeping other parameters constant.