In this chapter, the most efficient and widely used deposition technique Chemical Vapor Deposition (CVD) has been explained, and also its some types such as Atmospheric Pressure Chemical Vapor Deposition (APCVD), Low-Pressure Chemical Vapor Deposition (LPCVD), and Ultra-high Pressure Chemical Vapor Deposition. Each technique has been explained according to its basics, introduction, chemical process, Figures, Explanation of the figures, advantages and disadvantages as well as their advanced applications in a wide range of fields. Each CVD method is different from one another as atmospheric pressure CVD requires a moderate range of pressure to perform the deposition process, while the Low-Pressure CVD process cannot operate to deposit film on atmospheric pressure, it must require a low-pressure range and high temperature to perform deposition process. Ultra-high pressure requires a high range of pressure and temperature to deposit an identical layer of material on the substrate. Every technique has different properties and variation in the thickness of the thin film deposition layer. Overall, CVD is widely used due to the diverse range of properties and applications according to the properties.