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With the development of terahertz frequency band, the size of the slow wave structure, which plays key roles in realizing effective interaction between electron beams and terahertz signals, has decreased by an order of magnitude from mm to hundreds of μm scale. How to produce the high aspect ratio and fine-structure in such a small μm-scale structure has become a key factor that largely restricts the performance of terahertz devices. With the help of fully utilizing the excellent tolerance of UV-LIGA technology (Ultraviolet Lithography, Galvano forming, Abforming), the influence of intrinsic material properties of copper substrates (including oxygen content, grain size and distribution) on the surface polishing accuracy and slow wave microstructure processing accuracy are firstly investigated. The results indicate that low oxygen content and fine-grained substrates are beneficial for achieving high surface quality and precision of photolithography processing channels, which can satisfy the precision design requirements of 0.34 THz or even higher frequency terahertz slow wave structures.

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Progress of High-Quality Copper Substrates for Terahertz Vacuum Electronic Devices

  • 会议论文

  • 发表日期：

    2026年

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  • Chao Zhang,
  • Ying-Kui Xue,
  • Qiao Xue,
  • Yang Xia,
  • Yuan-Feng Xie,
  • Qi Jiang,
  • Pan Pan,
  • Hong-Fei Zhang

摘要

With the development of terahertz frequency band, the size of the slow wave structure, which plays key roles in realizing effective interaction between electron beams and terahertz signals, has decreased by an order of magnitude from mm to hundreds of μm scale. How to produce the high aspect ratio and fine-structure in such a small μm-scale structure has become a key factor that largely restricts the performance of terahertz devices. With the help of fully utilizing the excellent tolerance of UV-LIGA technology (Ultraviolet Lithography, Galvano forming, Abforming), the influence of intrinsic material properties of copper substrates (including oxygen content, grain size and distribution) on the surface polishing accuracy and slow wave microstructure processing accuracy are firstly investigated. The results indicate that low oxygen content and fine-grained substrates are beneficial for achieving high surface quality and precision of photolithography processing channels, which can satisfy the precision design requirements of 0.34 THz or even higher frequency terahertz slow wave structures.