Thermo-electric Coupling of Temperature Distribution in Avionics Devices CBGA Components

Ceramic ball grid array (CBGA) packaging is widely employed in avionics devices due to its high density and high reliability. However, it faces challenges in thermal management and thermal fatigue of solder joints. This study proposes a thermo-electrical coupled numerical analysis method for CBGA component in avionics devices. Meanwhile, a SIwave-Icepak collaborative simulation platform is developed to systematically investigate the impact of various operating loads and multiple heat dissipation conditions on the thermal characteristics of CBGA components. The research found that under natural heat dissipation conditions, 80% or more of the operating load exceeds the device’s safe temperature threshold. Forced air cooling can significantly improve the heat dissipation effect. When wind speed is increased to 3.5 m/s, the maximum temperature drop can reach 40%. Furthermore, when the wind speed exceeds 0.5 m/s, it ensures the thermal reliability of the CBGA component under full ultimate load. The results hold significant implications for enhancing the reliability of CBGA components in complex airborne environments.