Research on the Application of High Thermal Conductivity Ceramics for Aviation Computers

High thermal conductivity ceramic (HTC ceramic) materials are of significant research importance due to their excellent thermal conductivity properties. This paper introduces common types of HTC ceramics, discusses the importance of heat dissipation for aviation computer chips in the context of aviation computer equipment environmental characteristics, and proposes an auxiliary heat dissipation solution for aviation computers based on HTC ceramics. Through designed experiments and physical testing, the effectiveness and feasibility of the proposed solution were verified. Furthermore, simulation results demonstrated that the auxiliary heat dissipation technology based on HTC ceramics for aviation components can effectively reduce thermal strain in chips and enhance their temperature cycling lifetime. This approach provides a novel solution for the overall thermal management design of aviation computers.