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As a core component of aircraft power distribution systems, the operational reliability of the Solid State Power Controller (SSPC) is critical to flight safety. Its MOSFET-based power devices, which are key to power distribution, experience drastic junction temperature fluctuations under wide variable loads, accelerating aging and inducing faults. Accurate junction temperature monitoring is therefore vital to ensuring SSPC reliability. This paper develops a junction temperature estimation system based on the Foster thermal network model, employing the adaptive step Runge–Kutta algorithm and identifying thermal parameters with Bayesian-optimized least squares. Multi-strategy validation shows an estimation error of less than 2 ℃ under variable loads and a thermal impedance fitting RMSE as low as 0.005 ℃/W, laying a foundation for health assessment and prediction of power devices.

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Research on Junction Temperature Estimation Method for SSPC Power Devices Based on Thermal Network Model

  • 会议论文

  • 发表日期：

    2026年

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  • Limin Jia,
  • Haitao Yang,
  • Xin Liu,
  • Qinghan Wei,
  • Chang Yang

摘要

As a core component of aircraft power distribution systems, the operational reliability of the Solid State Power Controller (SSPC) is critical to flight safety. Its MOSFET-based power devices, which are key to power distribution, experience drastic junction temperature fluctuations under wide variable loads, accelerating aging and inducing faults. Accurate junction temperature monitoring is therefore vital to ensuring SSPC reliability. This paper develops a junction temperature estimation system based on the Foster thermal network model, employing the adaptive step Runge–Kutta algorithm and identifying thermal parameters with Bayesian-optimized least squares. Multi-strategy validation shows an estimation error of less than 2 ℃ under variable loads and a thermal impedance fitting RMSE as low as 0.005 ℃/W, laying a foundation for health assessment and prediction of power devices.