Scholarlink

Ball Grid Array (BGA) packaging is critical for high-reliability electronics, yet solder joint failures under random loading remain a persistent challenge. This paper introduces a finite element analysis (FEA)-driven optimization framework to minimize solder joint stress by adjusting chip layout position on printed circuit board (PCB). A 7 × 7 BGA model with 49 solder joints was developed, and random loading analysis under a 20–2000 Hz PSD load identified edge-solder stress concentrations up to 112.43 MPa. Using response surface methodology (RSM), a model was constructed with lateral X and longitudinal Y offsets as design variables. Particle swarm optimization (PSO) then determined the optimal layout at X = 27 mm, Y = 0 mm, reducing maximum Von Mises stress by 73.6% to 29.64 MPa. This study demonstrates that layout optimization alone achieves reliability improvements as traditional structural modifications. The methods for adjusting chip packaging position establishes quantitative design principles for BGA packaging in high-reliability applications, demonstrating engineering significance for developing durable electronic systems.

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Optimization of BGA-Packaged Chip Position Parameters Under Random Loading via Response Surface Methodology

  • 会议论文

  • 发表日期：

    2026年

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  • Jin Wang,
  • Bin Hu,
  • Yunyun Sun,
  • Shijing Wu

摘要

Ball Grid Array (BGA) packaging is critical for high-reliability electronics, yet solder joint failures under random loading remain a persistent challenge. This paper introduces a finite element analysis (FEA)-driven optimization framework to minimize solder joint stress by adjusting chip layout position on printed circuit board (PCB). A 7 × 7 BGA model with 49 solder joints was developed, and random loading analysis under a 20–2000 Hz PSD load identified edge-solder stress concentrations up to 112.43 MPa. Using response surface methodology (RSM), a model was constructed with lateral X and longitudinal Y offsets as design variables. Particle swarm optimization (PSO) then determined the optimal layout at X = 27 mm, Y = 0 mm, reducing maximum Von Mises stress by 73.6% to 29.64 MPa. This study demonstrates that layout optimization alone achieves reliability improvements as traditional structural modifications. The methods for adjusting chip packaging position establishes quantitative design principles for BGA packaging in high-reliability applications, demonstrating engineering significance for developing durable electronic systems.