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This chapter details solid mechanics theories and empirical models relevant to electronic packaging reliability. Coverage includes material behavior (brittle/viscoplasticity/creep) and constitutive models like Chaboche, Anand, and Hyperbolic Sine. Reliability prediction focuses on solder fatigue using the Coffin-Manson, energy density models (Darveaux), and the modified energy density model. Brittle fracture criteria and interfacial delamination analysis using the Modified Virtual Crack Closure Technique (MVCCT) are also presented.

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Fatigue and Fracture Models for Electronic Packaging

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  • 发表日期：

    2026年

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  • John Lau,
  • Kuo-Ning Chiang

摘要

This chapter details solid mechanics theories and empirical models relevant to electronic packaging reliability. Coverage includes material behavior (brittle/viscoplasticity/creep) and constitutive models like Chaboche, Anand, and Hyperbolic Sine. Reliability prediction focuses on solder fatigue using the Coffin-Manson, energy density models (Darveaux), and the modified energy density model. Brittle fracture criteria and interfacial delamination analysis using the Modified Virtual Crack Closure Technique (MVCCT) are also presented.