With the rapid development of flexible DC transmission technology, IGBT and other devices in high-voltage and high-power power electronic equipment have more stringent requirements for packaging materials. As a common packaging insulation material, organic silicon gel’s dielectric performance in low temperature environment is critical to equipment operation. In this study, three typical organosilicon gel, Wacker 612, Shin-Etsu KE-1066 and Wacker 915HT, were selected to conduct dielectric tests using a broadband dielectric impedance analyzer in the temperature range of −50 °C ~ 0 °C and the frequency range of 0.01 Hz ~ 1 MHz. According to the dielectric spectrum measurement results of different silicone gel, the corresponding improved Cole-Cole model and its fitting method. The model and fitting method can obtain good fitting results. At the same time, using Arrhenius to fit parameters such as DC conductivity, relaxation strength, and relaxation time, in-depth research on the variation patterns of these parameter values at low temperatures. It was found that low temperature inhibits molecular motion, leading to a decrease in low-frequency relaxation intensity, an extension of relaxation time, and a significant decrease in conductivity at low temperatures. The purpose of this study is to reveal the influence rule and internal mechanism of low temperature on the dielectric properties of silicone gel, and provide selection suggestions for the practical application of silicone gel in low temperature environment according to the research results