Advanced Heat Sink Materials: Thermal and Mechanical Characterization of Noble Metal-Grafted Graphene Metal Matrix Composites

Thermal management of electronic processing is a challenge due to increasing current density. Noble metal decorated GNP reinforced copper matrix composites have been developed and investigated for thermal management of smart electronic devices. Nanoparticles of noble metal were grafted on GNP with a limited amount of oxygen, and the decorated GNP was reinforced with copper and compacted at low pressure to create voids in the sintered samples to achieve convection and conduction characteristics in the samples. Decorated GNP was characterized by the Field Emission electron microscope, and XRD. The morphological analysis of the interface of Ag/N-doped Ag decorated graphene reinforced copper matrix composites was performed using field emission scanning electron microscopy. Sintered samples were tested for thermal conductivity and dispersion of decorated GNP in copper matrix. The composites also demonstrated superior mechanical properties, with Ag decorated GNP/Cu exhibiting a 60% increase in microhardness compared to pure copper. The results showed that nano particles of the noble metal were well attached to GNP, sintered, and thermal conductivity was improved. Tests performed on LED light showed 15 °C lower operation temperature and an increase in luminous.