This study investigates the sulfurization effect on the aspects of electrical, microstructure, and temperature coefficient of resistance for Ni-Cr and VN thin films grown by reactive RF magnetron sputtering system. The results indicated that sulfurization distinctly decreased the conductivity of Ni-Cr thin films, this is attributed to high resistivity of NiS and Ni3S2. However, high power Ni-Cr samples exhibit better anti-sulfurization properties due to denser crystalline quality. Besides, less Cr-based sulfide found on the surface of sulfurized samples because of lower redox potential and oxidation layers. In the temperature coefficient of resistance (TCR), most Ni-Cr thin films turn to negative TCR properties, because of insulated or semiconductive properties of sulfide. On the other hand, the VN thin films exhibit stable properties for electrical and microstructure after the sulfurization test. This indicates that VN thin films could be an excellent anti-sulfurization coating to prevent deceive corrosion.