Thermal Engineering of Power Electronic Systems

High power density leads to the intensive heating of semiconductor devices. Therefore, thermal engineering is necessary for power electronic systems design. Most popular types of power integrated circuits: hybrid modules, systems in package and on board were selected as Devices Under Test (DUTs). Effective engineering methods were used for DUT design to improve the thermal regimes: 1) using substrate material with higher thermal conductance for power hybrid modules: 2) selecting the optimal stack construction for systems in package; 3) using the packages and heat sinks with lesser thermal resistance for systems on board; 4) the electronic components placing on substrate or board with minimum thermal interaction. The advanced hardware-software system was used to realize the thermal engineering rout for different types of electronic components: power devices, ICs, PCBs, blocks and units. The practical examples confirmed the adequacy of modeling results for all the cases.