Static Calibration of Thin-Film Thermocouples with Different Hot Junction Temperatures Is Used to Analyze the Seebeck Coefficient

In this study, a simple static calibration method of thin-film thermocouple based on temperature extrapolation is proposed, aiming at accurately analyzing the Seebeck coefficient at different hot junction temperatures. By static calibration of thin-film thermocouples at different hot junction temperatures, we verify the effectiveness and reliability of this method. The experimental results show that this method can accurately calibrate the static characteristics of thin-film thermocouples and show good environmental adaptability and repeatability. In addition, it is found that the change of hot junction size has no significant effect on Seebeck coefficient, which provides important theoretical basis and practical guidance for the manufacture and application of thin-film thermocouples.