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Failure analysis examines the structure, process, and materials of integrated circuit packaging. It identifies weak points, analyzes defect formation and evolution, and determines failure mechanisms.

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Failure Analysis Techniques for Integrated Circuit Packaging

  • 章节

  • 发表日期：

    2026年

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  • Bin Zhou,
  • Yunfei En,
  • Si Chen

摘要

Failure analysis examines the structure, process, and materials of integrated circuit packaging. It identifies weak points, analyzes defect formation and evolution, and determines failure mechanisms.