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Integrated circuit (IC) packaging structures face a variety of mechanical issues during production, transportation, and usage. These issues span multiple fields of mechanics, including material mechanics, plasticity mechanics, and fracture mechanics. With the advent of very large-scale integrated circuits and the increasing density of electronic packaging, mechanical problems have become a significant cause of IC packaging failures. Therefore, clarifying the failure modes and mechanisms of packaging mechanics is crucial for addressing the mechanical reliability issues in IC packaging and provides valuable references for structural optimization design.

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Mechanical Characteristics and Testing of Integrated Circuit Packaging

  • 章节

  • 发表日期：

    2026年

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  • Bin Zhou,
  • Yunfei En,
  • Si Chen

摘要

Integrated circuit (IC) packaging structures face a variety of mechanical issues during production, transportation, and usage. These issues span multiple fields of mechanics, including material mechanics, plasticity mechanics, and fracture mechanics. With the advent of very large-scale integrated circuits and the increasing density of electronic packaging, mechanical problems have become a significant cause of IC packaging failures. Therefore, clarifying the failure modes and mechanisms of packaging mechanics is crucial for addressing the mechanical reliability issues in IC packaging and provides valuable references for structural optimization design.