Heat generation in integrated circuits is inevitable during operation. To ensure performance and reliability, it is crucial to minimize heat generation and dissipate it efficiently. Although advances in chip manufacturing have reduced the power consumption of individual transistors, power density has increased. Smaller feature sizes and higher packaging densities make heat dissipation a growing challenge. Thermal analysis helps assess the heat characteristics of microelectronic devices. Cooling technologies and structural optimization control the temperature of heat-generating components. Keeping internal temperatures within safe limits ensures stable and reliable operation. As a result, thermal management has become a key research focus in the industry.