Hermetic packaging provides a seal that is impervious to moisture and other contaminants for chips, and is typically used in harsh environments or in fields where high reliability is required, such as military electronic products in the aerospace and aviation industries. For devices with poor hermeticity, moisture can penetrate into the package within a few hours to several days, affecting the performance of the device and even causing failure. Especially for devices operating in special environments, a pressure difference is formed between the device cavity and the outside world, making it easier for the protective gas inside the device to leak out, and for external moisture, harmful gases, harmful ions, and particles to enter the device cavity, leading to leakage, parameter drift, and affecting the performance of the chip, ultimately resulting in frequent device failure issues.