The demand for enhanced thermal management to effectively dissipate the excess heat and minimize thermal stress is the need of the hour for several electronic cooling applications. From the literature, microchannel heat sinks with different flow configurations were investigated to augment the heat transfer and maintain an optimal working condition. However, parallel microchannels experience flow maldistribution behavior due to uneven mass flow rate among channels. Additionally, the latest integrated circuits (ICs) have been embedded with multicore chips, which develop a thermal gradient in the heat sink and drastically reduce the heat sink’s efficiency. These multicore chips generate localized high-temperature regions called hotspots, which have significantly higher heat flux. The present study tries to use an alveoli-inspired microchannel heat sink (AMCHS) to address the above challenges with hotspots to mimic the multicore processors. Initially, the preset topology model was designed, and a computational study was carried out for Reynolds numbers ranging from 300 to 1800 in line with two heat fluxes: 1000 W/cm2 for the hotspot area and 10 W/cm2 for the heat sink. The results show a profound improvement in the thermal performance of AMCHS for different Reynolds numbers and hotspot magnitudes. Simultaneously, the effect of velocity on the model reveals that the heatsink with more alveoli structures has maximum velocity at the center with 30% higher inlet velocity and contributes in improving thermal performance.