Chapter 8 examines the development of Fujian Province’s semiconductor industry as a representative regional case within China’s broader semiconductor supply chain. It outlines the industry’s rapid expansion since 2014, marked by investments exceeding 150 billion yuan and the emergence of an integrated industrial ecosystem encompassing design, manufacturing, packaging and testing, equipment, and materials. The chapter discusses key industrial clusters in Xiamen, Jinjiang, and Quanzhou, alongside notable achievements by firms such as Xiamen Lianxin (28 nm foundry), Rockchip (AIoT chips), and Sanan Integration (compound semiconductors). It assesses core strengths—including cross-Strait collaboration and robust materials capabilities—while also identifying persistent structural challenges, such as underdeveloped design capacity, financing constraints, weak policy coordination, and talent shortages. The chapter concludes by outlining strategic priorities: reinforcing key industry segments, promoting government–industry–academia collaboration, strengthening innovation platforms, and accelerating talent cultivation and supply chain integration to enhance regional resilience and drive sustainable growth.