Design of Universal Servo Control Module Based on Three-Dimensional Lamination Process Technology
摘要
Compact servo modules are vital in nuclear applications: precisely adjusting control rods to regulate fission rates, dynamically optimizing cooling systems, and enabling robots to perform high-risk tasks with accuracy. Their compatibility and low maintenance ensure safe, efficient reactor operation. All-electricity is one of the trends in nuclear power plants, where there are a large number of electric servo mechanisms. This paper relates to the circuit design and implementation of a high-density, high-integration, miniaturized and universal servo control module. At present, there are a large number of servo control products in nuclear power plants, which are mainly realized by using a single printed board or a combination of multiple printed boards and rigid-flexible boards. Servo control products relying on the existing technology are difficult to be applied to miniaturized and integrated products. The existing servo control products mainly have problems such as large volume, long development cycle, poor manufacturability, high cost, low reliability and poor universality. The purpose of this paper is to solve the problem of repeated customization for different servo products, and to solve the problems of large volume, long development cycle, poor manufacturability, high cost, low reliability and poor universality caused by repeated customization products by developing a servo control module with high density, high integration, miniaturization and universality. This paper is realized by using the method of hybrid circuit three-dimensional lamination process + configurable software control algorithm + configurable hardware circuit. By establishing an integrated architecture, carrying out functional clustering, determining the functional composition of standardized modules and building a software and hardware collaborative design system, better electrical interconnection performance, higher interconnection density and lower power consumption can be achieved, further reducing space volume and weight, and realizing modularization and generalization of standard circuits.