As the strength of two-phase crystalline materials mainly depends on their ability to nucleate new dislocations or move the existing ones from the soft phase/interface, proper knowledge of factors that play a major role in the first stages of plastic deformation is highly desirable. However, a basic understanding of the role of deformation mechanisms during wire drawing of the nanocomposites on the onset of plastic deformation is still lacking. In this work, atomistic simulations are applied to study and correlate the material’s response to deformation for two different Cu/Ag bilayers. The aim of these investigations is to study the deformation mechanisms involved during wire drawing of the Cu-Ag composites using Molecular Dynamics. This is simulated using uniaxial compression of the nanocomposites Cu/Ag bilayers. The simulated results suggest that the nucleation of partial dislocations from the Cu/Ag interface on multiple slip systems. It is observed that the leading partial dislocations nucleate first in the Cu phase on the {111} plane in the ⟨112⟩ directions. This may reveal that the dominant texture for the Cu-Ag material is brass. The stress–strain curves under compression are presented for two different aspect ratios of Cu/Ag bilayers. The [111] simulated stress–strain curves reveal a higher value of yield stress with an increase in the drawing reduction.