The avionics equipment encounters changeable and harsh thermal boundary conditions in its task profile, and its thermal performance directly affects electrical function, performance and reliability. The design flow of structure and heat dissipation for electronic equipment was proposed based on the engineering experience. An airborne modular integrated rack was taken as the research object to carry out the related research on design and analysis of forced air cooling. The structural configuration, heat dissipation scheme and thermal control measures of the airborne modular integrated rack were discussed, and the heat dissipation analysis was carried out. The results of simulation calculation and physical prototype test show that the thermal control design is reasonable and feasible. There will be certain reference and guiding significance to the design of similar electronic equipment.