Flexible polymer substrates are essential in printed Flexible Hybrid Electronics (FHE) due to their ability to support lightweight, bendable, and wearable devices. However, they require advanced patterning techniques during device fabrication to meet the demands for miniaturized, high-reliability printable circuits necessary for these applications. Advanced laser-based techniques can be used for circuit patterning with high precision and control, surpassing traditional methods like chemical etching, which often lack the required resolution and fail to protect the substrate or underlying materials. This study demonstrates the successful use of laser ablation to achieve sharp, high-resolution patterns (up to 20 μm feature size) on printed copper traces, with minimal substrate damage. Optical microscopy and profilometry revealed precise ablation, effective removal of residual debris post-cleaning, and high-resolution edge definition, significantly enhancing the quality of the patterned features. The process maintained electrical performance, with no conductivity in ablated regions and high conductivity in the remaining printed copper, highlighting its potential for high-reliability applications. Challenges such as residual debris and the practical resolution limit of 20 μm were identified, offering directions for further optimization. These results position laser ablation as a critical technique for advancing FHE applications requiring intricate, reliable patterns.