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The progression of modern electronics has increasingly demanded materials that not only ensure high performance but also support flexibility, miniaturisation, and scalability. Conductive inks have emerged as an essential technology in this context, offering the capability to form thin, electrically conductive pathways on both rigid and flexible substrates. These inks have become integral to semiconductor packaging, printed circuit integration, and advanced flexible electronics, where conventional metal interconnects and solder pastes often encounter limitations in mechanical compliance, thermal management, and design adaptability.

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Materials and Hybrid Strategies in Conductive Ink Technology

  • 章节

  • 发表日期：

    2026年

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  • Mohd Azli Salim,
  • Nor Azmmi Masripan,
  • Norida Mohammad Noor

摘要

The progression of modern electronics has increasingly demanded materials that not only ensure high performance but also support flexibility, miniaturisation, and scalability. Conductive inks have emerged as an essential technology in this context, offering the capability to form thin, electrically conductive pathways on both rigid and flexible substrates. These inks have become integral to semiconductor packaging, printed circuit integration, and advanced flexible electronics, where conventional metal interconnects and solder pastes often encounter limitations in mechanical compliance, thermal management, and design adaptability.