Surface Profile Angle Measurement Test

This chapter examines the influence of mechanical bending on the surface morphology, adhesion behaviour, and electrical performance of graphene nanoplatelet (GNP), silver (Ag) and zinc (Z) hybrid conductive ink deposited on copper substrates. Mechanical deformation represents one of the most critical challenges faced by conductive materials in flexible electronic systems. In applications such as flexible circuits, wearable sensors, and bendable electronic devices, conductive coatings are frequently subjected to repeated bending or flexing during operation. These mechanical stresses can significantly influence the integrity of conductive networks, interfacial adhesion, and ultimately the electrical reliability of the device. Therefore, understanding the relationship between bending deformation and electrical performance is essential for evaluating the durability and practical applicability of conductive inks designed for flexible electronics.