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The mechanical integrity and adhesive performance of graphene nanoplatelet (GNP), silver (Ag) and zinc (Z) hybrid conductive inks are fundamental to their application in flexible and stretchable electronic devices. The curing process plays an essential role, influencing the degree of cross linking within the polymeric matrix, the connectivity of conductive fillers, and ultimately the material’s ability to withstand mechanical loads while maintaining electrical functionality. Understanding the evolution of ink microstructure and its relationship with mechanical properties is essential for optimising performance and reliability.

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Curing Effects on Shear and Tensile Performance of GNP Hybrid Conductive Inks

  • 章节

  • 发表日期：

    2026年

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  • Mohd Azli Salim,
  • Nor Azmmi Masripan,
  • Norida Mohammad Noor

摘要

The mechanical integrity and adhesive performance of graphene nanoplatelet (GNP), silver (Ag) and zinc (Z) hybrid conductive inks are fundamental to their application in flexible and stretchable electronic devices. The curing process plays an essential role, influencing the degree of cross linking within the polymeric matrix, the connectivity of conductive fillers, and ultimately the material’s ability to withstand mechanical loads while maintaining electrical functionality. Understanding the evolution of ink microstructure and its relationship with mechanical properties is essential for optimising performance and reliability.