Optimising Curing Parameters to Enhance Electrical Conductivity and Peel Strength
摘要
The performance of hybrid conductive inks is critically influenced by the interplay between their material composition, curing conditions, and environmental exposure. In particular, graphene nanoplatelet (GNP), silver (Ag) and zinc (Z) hybrid inks exhibit complex electrical and mechanical behaviour that is highly sensitive to curing temperature, curing duration, and thermal treatment, which together determine the densification, particle connectivity, and interfacial adhesion of the ink. Conductive inks in flexible and wearable electronics must maintain low electrical resistance for reliable current flow while simultaneously adhering strongly to substrates to withstand mechanical stress, deformation, and environmental variations. Achieving this dual functionality requires careful optimisation of both thermal and processing parameters.