The growing demand for flexible and wearable electronic devices has created a significant need for conductive materials that can maintain stable electrical performance while undergoing repeated mechanical deformation. Unlike conventional rigid electronic components, flexible systems are frequently exposed to various forms of mechanical stress during operation, including bending, twisting, stretching, and compression. These mechanical forces can influence the structural integrity of conductive pathways within printed conductive inks, potentially leading to changes in electrical resistance and overall device performance. Therefore, understanding the mechanical reliability of conductive inks is a critical step in ensuring the long-term functionality of flexible electronic systems.