Additive Manufactured Electronics (AME) is becoming more and more popular, especially with new founded facilities, industrial solutions and co-operations around the world. Most of the technologies for AME are using different conductive material, most used are powder-based metals and conductive inks, which are melted by a laser or used as a filament for Material Extrusion (MEX). Both approaches are cost intensive, in addition, the MEX approach with conductive filaments, exhibits weaknesses in terms of resistance and current capability. To overcome these limitations, an additive manufacturing approach was investigated by implementing standard solder material into additively manufactured structures. First results showed that it is possible to print powerlines by using thermoplastic polymers with implemented channels. The solder was liquified and casted into these structures without a significant destruction of the structures. Furthermore, the conductivity of the outcoming powerlines meets the requirements which was set to the resistivity of pure solder material at ~0.12 µΩ m and got measured by in mean at 0.128 ± 0.044 µΩ m. Finally, the generated conductive structures proofed to be used as powerlines and as an antenna, and showed that a Hybrid Additive Manufacturing (HAM) process by using MEX and Solder-Casting is possible.