The rapid advancement in electronic and computing technologies over recent decades has led to increasingly complex components with significantly higher heat dissipation. Maintaining these components within strict temperature limits is crucial to prevent thermal damage and ensure longevity. As devices become smaller and more powerful, heat generation intensifies, demanding more effective cooling strategies. This chapter explores various liquid cooling methods, focusing particularly on phase-change immersion cooling. A comparative analysis highlights the superior performance of this technique in enhancing heat removal and maintaining optimal operating temperatures compared to conventional cooling methods.