Simulation of Hygrothermal Behavior of Wood Flooring with Floor Cooling Systems in Present and Future Climate Scenarios
摘要
As global warming increases the demand for active cooling methods grows, especially in urban areas. Existing floor heating infrastructure is used increasingly for space cooling purposes in residential buildings. This results in noticeably lower temperatures and may lead to higher humidity in the flooring area with increased moisture content in floor coverings. Due to that, new risks concerning deformation, delamination and mould growth for wood flooring occurs. In this work, the present and future impact of floor cooling on the hygrothermal behaviour of wooden parquets was analysed based on an extensive hygrothermal simulation study representing 2423 different parameter constellations using a sequence of different simulation tools. Therefore, different indoor climates, assuming different building alignments, apartment situations and outdoor climate scenarios, were simulated using DesignBuilder®. Subsequently these indoor conditions were set as boundary conditions in a hygrothermal paramter study of different flooring components in WUFI Pro®. Results show that inlet temperatures of cooling systems must be adapted considering apartment alignment, orientation, position, thermal conductivity and water vapour diffusion resistance of the flooring to avoid critical moisture contents leading to mould growth, cracking and high deformation.