Scholarlink

This chapter is a brief introduction to signal integrity (SI) and power integrity (PI) simulations as neighboring fields to EMC simulation. After introducing the concept of the eye diagram, we discuss how the MTL method—introduced in Chap. 8 for cable simulation—can be extended to model transmission lines on a PCB. This is followed by an application example in which the common mode in the board section of a USB 3.0 channel is calculated. In the second part of the chapter, we introduce power integrity (PI) simulation and perform an analysis of the power delivery network (PDN) of a digital PCB. In the final section, SI and PI simulations are combined into a single analysis, and the direct influence of the PDN on the common mode in the USB signal is investigated.

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Signal and Power Integrity

  • 章节

  • 发表日期：

    2026年

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  • Jan Hansen,
  • Andreas Barchanski

摘要

This chapter is a brief introduction to signal integrity (SI) and power integrity (PI) simulations as neighboring fields to EMC simulation. After introducing the concept of the eye diagram, we discuss how the MTL method—introduced in Chap. 8 for cable simulation—can be extended to model transmission lines on a PCB. This is followed by an application example in which the common mode in the board section of a USB 3.0 channel is calculated. In the second part of the chapter, we introduce power integrity (PI) simulation and perform an analysis of the power delivery network (PDN) of a digital PCB. In the final section, SI and PI simulations are combined into a single analysis, and the direct influence of the PDN on the common mode in the USB signal is investigated.