The adoption of artificial intelligence in industry is inextricably linked to Internet of Things technologies. The development of this technology generates new requirements for the mounting density and reliability of digital devices. Embedded components are becoming one of the solutions to improve the characterization of cyber-physical system elements. This technology allows electronic components to be placed inside printed circuit board, providing micro-miniaturization and increased reliability. The paper proposes intelligent methods to increase the mounting density and reduce the size of elements of cyber-physical systems without a significant complication of production technology. The proposed approach would allow companies that manufacture electronic devices to become more independent of electronic component suppliers. In the long term, these technologies can have an impact on increasing the economic freedom of the entire industry, making it more sustainable in the face of import substitution. Implementation of the proposed technology will allow realizing the integration of inductive and capacitive components in the printed circuit board. The main focus of the paper is on the way in which the embedded inductors and capacitors are implemented. The conclusion provides a comparative analysis of embedded components of cyber-physical systems and assesses promising directions for further development of the technology of embedded elements of cyber-physical systems within the framework of models of digital transformation of industry.