After layer formation, if powders get attached to a substrate or previously deposited layer, the incoming electrons will not be able to accumulate on the powder to disturb it. Attaching the powder can be done either by sintering or melting it. Melting or partial melting of powders cannot be an option, as all powders that are not melted by e-beams need to be detached and removed from the final part. As melting is the way for fabricating, the powders that are melted contribute to fabrication. Therefore, the powders are not supposed to be melted for any purpose other than contributing to the fabrication. This leaves another option, i.e., sintering, to be exercised for making connections among powders and with the substrate. Sintering implies that the powder will join another powder or substrate by forming a neck through atomic diffusion. Formation of the neck increases electrical conductivity of the layer and enhances contacts between the substrate and powders, which helps dissipation of charges to the ground, resulting in removal of the cause (charges) responsible for dislodging of powders.