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The molecular dynamics (MD) simulation method and the scratching process are used in this study to look at the mechanical properties of CuCrCoFeNi HEAs on a Cu substrate with indenter radius changes. The mechanical properties of this material are evaluated through surface morphology, stacking faults, tangential force, normal force, and friction coefficient. The results show significant mechanical differences in the CuCrCoFeNi high-entropy alloy layer on copper when changing the indenter radius.

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Effect of Indenter Size on Mechanical Properties of FCC CuCrCoFeNi Layer on Cu Substrate During Scratching Process

  • 会议论文

  • 发表日期：

    2025年

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  • Thanh-Nga Trinh,
  • Anh-Son Tran,
  • Van-Tuan Chu,
  • Anh-Tuan Nguyen

摘要

The molecular dynamics (MD) simulation method and the scratching process are used in this study to look at the mechanical properties of CuCrCoFeNi HEAs on a Cu substrate with indenter radius changes. The mechanical properties of this material are evaluated through surface morphology, stacking faults, tangential force, normal force, and friction coefficient. The results show significant mechanical differences in the CuCrCoFeNi high-entropy alloy layer on copper when changing the indenter radius.