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Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key direct materials used in memory modules and solid-state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. In this chapter, the influencing factors of such as prevailing hardware and components (actives, passives, connectors, enclosure, heatsink), polymeric materials (edge bond, corner fill, underfillUnderfill (UF)materials), thermal interface materialsThermal Interface Material (TIM)(TIMThermal Interface Material (TIM)), technical challenges with hardware engineering and characterization of system level packaging will be discussed.

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Hardware Reliability for Module and Solid-State Drives (SSDs)

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  • 发表日期：

    2025年

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  • Chong Leong Gan,
  • Chen Yu Huang

摘要

Semiconductor packaging materials have very strong influences in final package quality and reliability. There are many previous studies being carried out in characterizing effects of key direct materials used in memory modules and solid-state drive (SSDSolid State Drive (SSD)) for board level reliability [1–6]. In this chapter, the influencing factors of such as prevailing hardware and components (actives, passives, connectors, enclosure, heatsink), polymeric materials (edge bond, corner fill, underfillUnderfill (UF)materials), thermal interface materialsThermal Interface Material (TIM)(TIMThermal Interface Material (TIM)), technical challenges with hardware engineering and characterization of system level packaging will be discussed.