The development of additive manufacturing has made it possible to produce geometrically complex parts. However, these processes appear to inevitably introduce voids into the material, which may be responsible for premature failure. Upon thermomechanical treatment, microstructure evolutions such as grain boundary migration and recrystallization are promoted. Therefore, complex interactions between grain boundaries and voids emerge for heat-treated additively manufactured parts. In the literature, these interactions are typically studied using phase-field models that neglect the effect of stress and strain. In this work, a fully coupled phase-field and Cosserat crystal plasticity model reveals that grain boundary migration through a void contained in a bicrystal subjected to compression reduces the stress concentration in the region swept by the interface.